Trenton Systems - TAC Mission Computers
A family of fanless, durable, SWaP-C optimized small form factor mission computers providing maximum ruggedization, processing, storage, and security at the edge across the modern, multidomain battlespace.
- Ready for Extremes - Lightweight, sealed, and designed to operate between -40°C and +70°C in harsh environments
- Military-grade Connectors - Protect against dust, dirt, debris, and water as well as electromagnetic interference
- Zero-trust Architected - Hardware-based security measures encrypt and isolate data as it is being processed.
The TAC is a truly made-in-USA, small-formfactor, embedded, passive-cooled, sealed mission computer based on the COM Express Type 7 architecture.
Designed with tomorrow’s warfighters and servicemembers in mind, as well as the various tactical air, sea, land, space, and cyber environments they encounter daily, the TAC is ruggedized and secured with the latest hardware, firmware, and software security technologies adherent to DaR requirements, NIST, and CSfC.
Technical Highlights
- Single Xeon® D CPU
- 3x DIMM Slots
- Up to 2x SSDs
- 2x 38999 MIL Connectors
- Withstands -40°C to +70°C
Solution Highlights
- Intel® SGX includes predefined portions of memory that can better protect sensitive information.
- Five-year warranty means we will repair, replace, or refund for any potential defects in material, workmanship, and design
- Lifetime support gives you unlimited access to our team of experts that help troubleshoot problems and offer solutions.
- Strict revision control is achieved through Trenton’s approved vendor list (AVL), ensuring engineer-vetted parts.
- Counterfeit Protection Program (CPP) helps Trenton detect, remove, and destroy counterfeit parts and components.
- Vetted supply chain helps protect your system from potentially compromised counterfeit electronic parts and components.
- In-house engineers (hardware, software, mechanical, and electrical) control the design of your system down to the board and chip level.
- TAA compliance is achieved because Trenton manufactures BAM servers, and its other solutions, in the United States
- CSfC, ITAR, ISO9001, and AS9100 adherence and compliance allow Trenton to consistently provide secure, high-quality computing solutions.
More Product Information
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
Secure, compact, scalable fixed, front-removable, or rear-removable blade servers made right here in the USA that maximize performance and adaptability for evolving applications
- Size - Up to four server blades within a single rugged enclosure help efficiently utilize rack space.
- Weight - Compact system design reduces overall weight of rack server infrastructure.
- Power - Shared resources optimize hardware usage and limit power requirements.
- Cost - Modularity and increased footprint lower hardware and maintenance costs.
A family of fanless, durable, SWaP-C optimized small form factor mission computers providing maximum ruggedization, processing, storage, and security at the edge across the modern, multidomain battlespace.
- Ready for Extremes - Lightweight, sealed, and designed to operate between -40°C and +70°C in harsh environments
- Military-grade Connectors - Protect against dust, dirt, debris, and water as well as electromagnetic interference
- Zero-trust Architected - Hardware-based security measures encrypt and isolate data as it is being processed.
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
See more Key Features on Specifications & Details tab
- Dual Voltage ranges that support over-voltage testing on 480V-based systems
- Separate terminal blocks for single-phase and three-phase AC power supply outputs
- High Power AC and DC Source
- Auto paralleling for higher power system expansion
- Single and three-phase modes
- Arbitrary & Harmonic Waveform Generation
- Standard LXI LAN, USB, and RS-232, Optional GPIB
- Step, list, and pulse voltage transients with down to 500usec resolution
- Complete avionics power quality test suites
- 15kVA to 1MVA Power Levels
- Intuitive 5” color display for ease of navigation
- Internationally accepted test routines for EMI/EMC, Safety Compliance
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
- Solve machine vision applications efficiently by constructing flowcharts instead of writing program code, using field-proven tools for analyzing, classifying, locating, measuring, reading and verifying
- Use a single program for creating both application logic and operator interface
- Leverage deep learning for visual inspection through image classification and segmentation tools
- Rely on a common underlying vision library for the same results with an Iris GTX smart camera, vision systems or third-part computer
- Work with multiple cameras all within the same project or per project running concurrently and independently from one another, platform permitting
- Interface to Zebra AltiZ and third party 3D sensors to visualize, process and analyze depth maps and point clouds
- Communication options include discrete Zebra I/Os, RS-232, and Ethernet (TCP/IP, CC-Link IE Field Basic, EtherNet/IP, Modbus, OPC UA, and PROFINET, and native robot interfaces)
- Maximize productivity with instant feedback on image analysis and processing operations
- Receive immediate pertinent assistance through an integrated contextual guide
- Maintain control and independence through the ability to create custom flowchart steps
- Test communication with PLC using the built-in PLC interface emulator
- Protect against inappropriate changes with the Project Change Validator tool
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Trenton Systems
Founded in 1989, Trenton Systems provides the defense, government, industrial, and commercial markets with advanced, TAA-compliant high-performance computing solutions designed in consultation with customers. Equipped with the latest processing, AI/ML/DL, networking, security, and storage technologies, our solutions are designed in collaboration with our global partnership ecosystem.
All solutions, whether configurable or custom, are engineered right here in the USA within a vetted and transparent supply chain and fortified by comprehensive multi-layer cybersecurity across the hardware, firmware, software, and network stack. Proactive risk management methodologies coupled with zero trust provisioning ensure maximum reliability, longevity, and operational efficiency.
Trenton Systems’ rugged computing solutions meet or exceed the most stringent military and industrial standards, and are produced in the company’s headquarters in Atlanta, GA, which is certified to ISO 9001:2015 and AS9100D quality management standards.
Trenton Systems also provides in-house engineering, comprehensive lifecycle management, BIOS customization, strict revision control, and an industry-leading five-year warranty program.
Contact Details
Trenton Systems
3100 Breckinridge Blvd. Building 1200 Duluth, GA 30096, USA
Phone: 770-287-3100
Email: info@trentonsystems.com
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