• Up to 4 GHz Bandwidth 
• ±60 V Offset Capability 
• ±800 mV Dynamic Range 
• 50 kΩ DC Input Impedance 
• 1.2x Attenuation for low additive noise 
• MCX terminated cable with wide variety of connections: 
  • Solder-in (4 GHz) 
  • Coaxial Cable to U.FL receptacle (3 GHz) 
  • MCX PCB Mount (4 GHz) 
  • Browser (500 MHz) 
• ProBus Interface

• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

• Mechanical Platen Lift: Enhances safety during complex RF set-ups, increasing operator confidence and minimizing the risk of errors.
• Ease of Use and Advanced Automation: Fully compatible with FormFactor’s Autonomous RF and DC measurement assistants, as well as Velox Dash™ companion app control.
• Reconfigurable Platen Inserts: Quickly switch between TopHat, PCH, and IceShield inserts within minutes to support a wide variety of test configurations.
• Spacious Platen Design: Provides flexibility for both RF and DC setups without space limitations, ensuring easy integration of different configurations.
• Compact Design: Small footprint with field-upgradable components for smooth integration into existing test cells.
• Low-Volume MicroChamber and FemtoGuard Thermal Triaxial Chuck: Included by default

AI, cloud computing, and hyperscalers are accelerating the demand for ultra-high-speed, low-latency connectivity, taking us past Gigabit Ethernet and into the era of Terabit Ethernet.

Teledyne LeCroy’s Terabit Ethernet solutions are engineered to help you take full advantage of this new technology cycle. The Xena Ethernet Test Platform gives developers of semiconductor, NEMs, and hyperscalers the solutions they need to validate next-gen silicon, network devices, and interconnects with confidence.

From Layer 1 signal integrity and Layer 2 traffic generation and analysis, we have the solutions you need to simulate, stress, and certify real-world performance. Support for 224Gbps electrical lanes, advanced FEC, and PCS diagnostics ensure readiness for tomorrow’s networks. Compact, desktop-friendly hardware combined with intuitive software and powerful automation ensure seamless lab-to-production workflows.

Whether you’re path-finding 1.6T or optimizing 800G deployments, Xena can fast-track your innovation cycle. Test smarter, deploy faster and reap the rewards.

• Bandwidth models from 8 GHz to 30 GHz
• Low loading and high impedance for minimal signal disturbance
• Wide variety of tips:
  • Standard and high-sensitivity 30 GHz solder-in tips
  • High-temperature solder-in tip with 1-meter lead
  • QuickLink adapter for mixed-signal probing
  • Handheld browser tip
  • Tips for direct oscilloscope connection to CrossSync PHY protocol analyzer interposers
• Built-in tip identification for simple setup and precise signal reproduction
• Ideal for debug and validation of:
  • PCIe 1.0 to 6.0
  • DDR3/LPDDR3
  • DDR4/LPDDR4/LPDDR4X
  • DDR5
  • Other high-speed serial interfaces

• Vector Network Analyzer Frequency Range from 10 MHz up to 3.2 GHz
• Spectrum Analyzer Frequency Range from 9 kHz up to 3.2 GHz
• -156 dBm/Hz Displayed Average Noise Level (Typ.)
• -98 dBc/Hz @10 kHz Offset Phase Noise (1 GHz, Typ.)
• Total Amplitude Accuracy < 1.2 dB
• 1 Hz Minimum Resolution Bandwidth (RBW)
• All-Digital IF Technology
• Standard Preamplifier
• Distance to fault capability using VNA time domain analysis
• Up to 1.5 GHz Tracking Generator Kit
• Built-in Advanced Measurement capability (CHP, ACPR, OBW, CNR, TOI, etc)
• 10.1 lnch WVGA (1024 x 600) Display

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Accessories available, such as black bodies and optical motion analysis tools
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation