Teledyne LeCroy - Probe Adapters
Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.
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TekProbe to ProBus Probe Adapter |
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ProLink to 2.92mm Adapter with Probe Power and Communication Pass Through |
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ProLink to 2.92mm ProAxial Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProBus Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProLink Adapter with Probe Power and Communication Pass Through |
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More Product Information
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
- Vector Network Analyzer Frequency Range from 10 MHz up to 3.2 GHz
- Spectrum Analyzer Frequency Range from 9 kHz up to 3.2 GHz
- -156 dBm/Hz Displayed Average Noise Level (Typ.)
- -98 dBc/Hz @10 kHz Offset Phase Noise (1 GHz, Typ.)
- Total Amplitude Accuracy < 1.2 dB
- 1 Hz Minimum Resolution Bandwidth (RBW)
- All-Digital IF Technology
- Standard Preamplifier
- Distance to fault capability using VNA time domain analysis
- Up to 1.5 GHz Tracking Generator Kit
- Built-in Advanced Measurement capability (CHP, ACPR, OBW, CNR, TOI, etc)
- 10.1 lnch WVGA (1024 x 600) Display
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
- High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
- RF bandwidth to 500 MHz
- Long probe life: > 250,000 contacts
- Beryllium-copper tips for gold pads or tungsten for aluminum pads
- Oscillation-free testing of wide-bandwidth analog circuits
- Use with ACP series probes to provide functional at-speed testing for known-good-die
- Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
- Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 150 mm or single dies
- Up to six positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
- 1 MHz max line rate
- 65dB dynamic range
- Onchip 2x binning
- Mono/HDR/HFW
- Multi-arrays TDI
- Dual CLHS CX4 AOC output
- Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
- Online design configuration tool helps you to specify your probe in minutes
- All designs are fully quadrant compatible
- Full solution includes probes, calibration substrates, stations, accessories and software
- Scalable architecture for future needs
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
Teledyne LeCroy
Website
12bit MSO's 40 Mhz to 100 GHz, Probes, Series Network & Logic Analyzers
