Focus Microwaves - On-Wafer Delta Tuners
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Introducing Auriga’s 5th generation pulsed IV/RF characterization system delivers unparalleled performance, capturing measurements with incredible speed and accuracy. Pulsed IV (current-voltage) measurements have emerged as the preferred method of capturing current-voltage characteristics of active devices such as field effect (FETs) and bipolar junction (BJTs) transistors. With the growing popularity of higher-power devices, like GaN HEMTs, LDMOS, SiC, and graphene, current and voltage requirements are constantly being pushed higher and higher.
- Repair-focused environment for XJDeveloper / XJRunner tests.
- Full Connection test.
- RAM, Flash and other non-JTAG device tests.
- Flash, FPGA, CPLD and EEPROM programming.
- Layout Viewer* to show the physical location of faulty nets, pins and components.
- Schematic Viewer* to show the circuit design around faults.
- Direct control of the pins/balls of JTAG devices.
- View pin states graphically in real time or capture them in the Waveform Viewer.
- Trace signals to identify shorts, opens and other faults.
Noise measurements allow the determination of the four Noise Parameters of a device (transistor). Focus’ Noise Modules integrate well with various third party noise receivers.
Noise Parameters: These are four numbers that fully describe the noise behaviour of an active or passive device (twoport) at a given frequency. For practical reasons we use the following quantities as Noise Parameters:
Focus’ noise parameter extraction routines leverage the PNA-X’s unique implementation
of the cold-source noise figure measurement technique. This specific technique requires a noise source to determine the kBG (gain-bandwidth constant) of the system and a passive mechanical tuner is used to characterize the noise receiver across both the impedance and frequency space. This step is imperative to obtain fully vector-source-corrected measurements.
of the cold-source noise figure measurement technique. This specific technique requires a noise source to determine the kBG (gain-bandwidth constant) of the system and a passive mechanical tuner is used to characterize the noise receiver across both the impedance and frequency space. This step is imperative to obtain fully vector-source-corrected measurements.
A RF down conversion stage might be required if the frequency of noise measured exceeds the receiver’s bandwidth. Focus offers noise modules which support down conversion for optimal speed and performance.
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
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Probe positioners placed inside vacuum chamber
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive alignment functions – from simple wafer alignment and mapping to automated alignment and test of multiple singulated chips, like IR – Focal Plane Arrays
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
Focus’ modular microstrip, high power and ultra low loss coaxial RF Test Fixtures are designed mainly for load pull testing of packaged transistors. All Focus test fixtures come with TRL calibration standards and support most transistor packages sized from less than 0.1″ and up to 1″.
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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
See more Key Features on Specifications & Details tab
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