Teledyne DALSA - Linea ML Leading-Edge CMOS Camera
- High speed up to 100 kHzx3 line rate (Mono) or 300 kHz line rate (Color)
- RGB native colors (Color)
- Independent exposure control (Color)
- Subpixel spatial correction (Color)
- Sequential exposure control (Mono)
- High dynamic range (Mono)
- Up to 100 m optical cable length
The Linea ML brings leading edge CMOS technology that is faster than ever, with affordable multiline architecture that enables the newest, most powerful inspection techniques including HDR, color and multispectral analysis, and multi-field imaging (single-pass bright/darkfield). With a native fiber optic interface for easy, low-cost long cabling, the Linea ML opens new horizons in inspection.
Performance and Value
The Linea ML brings leading edge CMOS technology that is faster than ever, with affordable multiline architecture that enables the newest, most powerful inspection techniques including HDR, color and multispectral analysis, and multi-field imaging (single-pass bright/darkfield). With a native fiber optic interface for easy, low-cost long cabling, the Linea ML opens new horizons in inspection.
Expand your vision capabilities
The Linea ML was thoughtfully designed to enable economical variations in functionality, like HDR, and multiple spectral bands—color, color plus mono, color plus NIR, and multi-field. Maximum line rate is 300 kHz aggregate: 300 kHz in mono, 3 x 100 kHz in RGB, or 4 x 75 kHz in RGB+NIR.
Detect defects on and beneath the surface
The Linea ML 8k multispectral provides spectrally independent RGB and NIR outputs with minimal spectral crosstalk. This makes it uniquely capable of handling some of the most challenging inspection applications by accurately detecting defects both on and beneath the surface of a wide variety of materials and products. For inspection applications such as banknotes and other high security prints, the Linea ML 8k multispectral accurately detects security inks printed on the paper that reflect near infrared (NIR) light. In other applications like semiconductor wafer and printed circuit board (PCB) inspection, the camera easily reveals defects below the surface penetrated by the NIR light.
View Linea ML 8k multispectral
CLHS Native Fiber Interface
The Linea ML gives you better sensitivity, lower noise, and higher line rates up to 300 kHz via a CLHS interface. Linea ML is our first camera with native fiber optic connectors, which lets you take advantage of low-cost fiber for long cables and immunity to electrical interference.
Pair with Xtium2 for ultimate performance
Building on the field proven capabilities of Teledyne DALSA’s Xtium™ family of frame grabbers, the Xtium™2 CLHS FX8 features fiber optic cabling for the CameraLink HS interface on the PCI Express™ Gen 3.0 platform. The Xtium2 CLHS FX8 boards feature CLHS X-protocol for high efficiency transmission, support up to four bidirectional SFP+ modules to delivery aggregate bandwidth of 4.0 GB/s and can reach cable lengths beyond 100 meters - all in a compact, half-length, single slot solution.
Feature Highlight: Multisource Imaging
Challenge: Reduce time and complexity required to capture both brightfield and darkfield images
Solution: With multiple strobed light sources, one monochrome camera can capture brightfield and darkfield images simultaneously in a single pass.
More Info: download our Sequential Mode app note or contact us to discuss
Family Specifications
|
Camera Type |
Line Scan |
|---|---|
|
Sensor Technology |
CMOS |
|
Supported Interfaces |
Camera Link HS, Fiber Optic |
|
Spectrum Capability |
Visible (400-700 nm), Near Infrared (700-1000 nm) |
Models
|
Model Number |
Resolution |
Spectrum |
Interface |
Pixel Size (μm) |
Max Line Rate |
|---|---|---|---|---|---|
|
8192 x 4 |
Mono |
Camera Link HS |
5 |
300 kHz |
|
|
8192 x 3 |
Color |
Camera Link HS |
5 |
70 kHz |
|
|
16384 x 3 |
Color |
Camera Link HS |
5 |
141 kHz |
|
|
16384 x 3 |
Color |
Camera Link HS |
5 |
300 kHz |
|
|
16384 x 3 |
Color |
Camera Link HS |
5 |
75 kHz |
|
|
8192 x 4 |
Mono |
Camera Link HS |
5 |
300 kHz |
|
|
8192 x 3 |
Color |
Camera Link HS |
5 |
280 kHz |
|
|
16384 x 4 |
Mono |
Camera Link HS |
5 |
300 kHz |
|
|
16384 x 1 |
Mono |
Camera Link HS |
5 |
140 kHz |
|
|
16384 x 1 |
Mono |
Camera Link HS |
5 |
70 kHz |
|
|
8192 x 4 |
Mono |
Camera Link HS |
5 |
280 kHz |
More Product Information
- All Digital IF technology
- 10.1” WVGA (1024 x 600) Display
- Frequency range from 9 KHz up to 3.2 GHz
- -161 dBm/Hz Displayed Average Noise Level (Typ)
- -98 dBc/Hz @ 10 khz Offset Phase Noise (Typ)
- Total Amplitude Accuracy < 0.7 dB
- 1 Hz Minimum Resolution Bandwidth (RBW)
- Comes with Preamplifier
- Available in 30MHz, 40MHz, 60MHz, 80MHz, 120MHz, 200MHz, 350MHz and 500MHz models
- All models feature 2 channels
- Max Sampling rate of 150 Msa/s (30MHz & 60 MHz) 1.2 Gsa/s (40MHz, 80MHz, 120MHz) and 2.4 Gsa/s (200MHz, 350MHz and 500MHz) models.
- Up to 16-bit vertical resolution (14-bit on 30MHz & 60MHz models).
- All models have 4.3" Touchscreens.
- Excellent analog and digital modulation types available (AM, DSB-AM, FM, PM, PSK, FSK, ASK and PWM)
- Vector Network Analyzer Frequency Range from 10 MHz up to 3.2 GHz
- Spectrum Analyzer Frequency Range from 9 kHz up to 3.2 GHz
- -156 dBm/Hz Displayed Average Noise Level (Typ.)
- -98 dBc/Hz @10 kHz Offset Phase Noise (1 GHz, Typ.)
- Total Amplitude Accuracy < 1.2 dB
- 1 Hz Minimum Resolution Bandwidth (RBW)
- All-Digital IF Technology
- Standard Preamplifier
- Distance to fault capability using VNA time domain analysis
- Up to 1.5 GHz Tracking Generator Kit
- Built-in Advanced Measurement capability (CHP, ACPR, OBW, CNR, TOI, etc)
- 10.1 lnch WVGA (1024 x 600) Display
- 150 MHz, 2 analog channels
- 8 synchronized digital channels (T3AWG2152-D only)
- 16-bit vertical resolution
- 128 MPts @Ch waveform memory
- Max sampling rate of 600 MS/s
- S-parameters DC to 40 GHz, single-ended and mixed-mode
- Impedance Profile with <1 mm resolution, differential and common-mode
- Internal, automatic OSLT calibration
- USB-connected, small, lightweight
- Flexible display of the measurements
- Remove effects from fixtures, connectors and cables
- Emulate eye diagrams with CTLE, DFE and FFE equalization
- Advanced jitter analysis
- DigRF v4 Decodes
- Low-speed (26 Mb/s)
- Medium-speed (1248 Mb/s)
- High-speed (1456 Mb/s)
- DigRF v3 Decodes
- Low-speed (6.5 Mb/s)
- Medium-speed (26 Mb/s)
- High-speed (312 Mb/s)
- Convert DigRF 3G and v4 I and Q digital data to corresponding analog waveforms
- Correlate analog waveforms with protocol decode on one screen
- View decoded data in hexadecimal format
- Decode information expands as the time base is adjusted or zoomed
- Convenient table display with quick “Zoom to byte” capability
- Quick search capability for specific message packets
- Small
- Complete, closed-loop system with embedded controls in less than 28 x 13.2 x 7.5 mm
- Precise
- 0.5 µm resolution
- 6 mm of travel
- Simple system integration
- High-level motion commands over standard serial interface (I2C or SPI)
- Flexible system, fast to market
- Rapidly configurable for push or pull motion
- Low voltage / low power use
- 3.3 V input, <500 mW power use
- Holds position when power is off
-
Compact probe head
-
Supports fine pitch SMD probing
-
Rugged, Sharp tip
-
HF optimized connection accessories
-
Over 30 accessories
-
Low input capacitance
Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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