• Allows TekProbe interface level II probes to work with any ProBus-equipped Teledyne LeCroy oscilloscope 
• Automatic probe detection 
• Provides all necessary power and offset control to the attached probe 
• Supports probes up to 4 GHz 
• Easy firmware updates 
• Wide variety of probes supported including: Preamplifiers, Current Probes, Single-Ended Active Probes and Differential Active Probes

• Output White Gaussian noise
• 127 dB of attenuation; 0.1 dB step size
• Units > 2 GHz have total attenuation of 79.9 dB
• Low distortion signal path
• Noise attenuator accuracy:
  • ±0.2 dB or 0.5% at 1 – 500 MHz
  • ±0.2 dB or 1% at 0.5 – 1.0 GHz
  • ±0.3 dB or 2% at 1 – 2 GHz
• Standard connectors SMA female
• Power 115 VAC, 60 Hz; 110 VAC, 220 VAC
• Operating Temperature: -10° to +65°C

Our 2 Series cable assembly showcases excellent phase stability against bending, developed with microwave/mmWave measurement environments in mind.

Its flexibility means low repulsion, reducing the load on the measured object

The TEM horn antenna is an antenna used for conducting close proximity radiation immunity evaluation test (near electromagnetic field immunity test) of electromagnetic waves radiated from various wireless transmitters such as mobile devices. 

In the future, close proximity radiation immunity evaluation test using the TEM horn antenna is expected to expand to various product standards such as medical equipment (IEC 60601-1-2) and multimedia equipment (CISPR 35).NoiseKen's TEM horn antenna has a wide band, low VSWR, and wide electric field uniformity offering an ideal solution for an efficient close proximity radiation immunity test. 

• A TEM horn antenna compliant with IEC 61000-4-39 Ed.1. 
• Test without changing the antenna in the frequency range of 380MHz to 6GHz. 
• Low VSWR and high GAIN enable efficient electromagnetic wave radiation. 
• Wide field uniformity reduces the number of times of movement of the antenna when radiating the EUT. 
• Since the maximum point of the near electric field distribution for each frequency is at the center, enables radiation on the EUT based on the axis of the antenna. Hence, significantly simplifies test point alignment.

• 1-slot 1U allows high-port density in a robust form factor
• Price/performance
• Ease of use
• Advanced architecture
• User-friendly software (XenaManager, Xena OpenAutomation)
• Test automation with XOA
• Three years’ software updates
• Three years’ hardware warranty
• Free tech support & training for the product lifetime

OptoVue

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

Horizontal Die-Level Edge Coupling

• Highest accuracy in test results
• Lowest coupling loss
• Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
• Reduced risk of damaging fibers with collision avoidance technology
• Ease of use for less experienced users
• Enables close simulation of real-world conditions with device performance closest to the final application

See "Specifications & Details" tab for more key features

• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

There are 2 versions of the Xena chassis: the standard B720 and the high-performance B2400. Both versions consist of a 4U modular chassis that can be equipped with up to 12 Xena Ethernet test modules to provide high port density and low power consumption.