Teledyne DALSA - BOA3 Flexible Smart Camera for Industrial Automation
Capture, Process, Control at the Edge
- Resolutions 1.2 to 12 megapixels
- Quad-core processor
- Broad range of onboard I/O
- Compact, rugged, IP67 enclosure
- Run AI inspection models on-camera
- No-code machine vision development
Introducing BOA3, Teledyne DALSA’s fastest, most flexible smart camera platform. BOA3 is a highly integrated vision system in a compact smart camera format.
Machine Vision at the Edge
BOA3™ is Teledyne DALSA’s next generation AI-powered smart camera designed to meet the needs of the most complex, demanding embedded machine vision applications.
Flexible Embedded Platform
BOA3 can be quickly configured using a PC and then installed on a manufacturing line to run inspections standalone without any extra equipment. With multiple sensor, lens, and integrated lighting options, BOA3 can be configured to perform complex machine vision tasks.
On-Camera AI
Combine AI inspection models with traditional geometric machine vision tools to solve a full spectrum of inspection applications. Deploy Object Detection and Classification models created in Astrocyte™, Teledyne’s GUI-based AI trainer.
Compact, Rugged, IP67 Enclosure
BOA3’s all-aluminum 60 mm x 60 mm x 50 mm enclosure fits in almost anywhere on the production line. Its rugged M12 cable connectors, available integrated lighting, M4 mounting threads, and Power-over-Ethernet make installation easy.
Software Included
BOA3 Smart Cameras include iNspect™, an embedded vision application software designed to simplify the deployment of automated inspections on the factory floor. The simple, straightforward interface allows users to quickly configure and deploy accurate and repeatable applications.
Factory Integration
- Supports digital I/O, Serial and Ethernet communications for interfacing 3rd-party equipment
- Compatible with many standard protocols such as Modbus and TCP/IP
- Factory ready user interface that can be locked down to prevent unauthorized access
- .NET API for customers wishing to develop their own operator look and feel
- API supports C++, C#, and Visual Basic® in Microsoft® Visual Studio®
Models
|
Model Number |
Resolution |
Spectrum |
Interface |
Pixel Size (μm) |
FPS |
|---|---|---|---|---|---|
|
1280 x 960 |
Mono |
Ethernet 1 Gbps |
3.75 µm |
50 |
|
|
1280 x 960 |
Mono |
Ethernet 1 Gbps |
3.75 µm |
50 |
|
|
2560 x 1936 |
Mono |
Ethernet 1 Gbps |
2.8 µm |
35 |
|
|
4096 x 3072 |
Mono |
Ethernet 1 Gbps |
2.8 µm |
13 |
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More Product Information
- Available in 250 MHz and 350 MHz models
- 2, 4 and 8 channel modes
- 16-bit vertical resolution
- Max Sampling rate of 1.2 GS/s
- Max sinewave frequency of 250 MHz and 350 MHz respectively
Fully Integrated: With the ProBus™ interface, the AP033 becomes an integral part of the oscilloscope. The probe sensitivity and offset can be controlled from the oscilloscope front panel, the probe front panel, or by using remote control commands (GPIB or RS-232). Sensitivity, offset, input capacitance, and common mode voltage range are displayed on the oscilloscope screen. When used with a LeCroy digital oscilloscope, no external power supply is required.
- Allows TekProbe interface level II probes to work with any ProBus-equipped Teledyne LeCroy oscilloscope
- Automatic probe detection
- Provides all necessary power and offset control to the attached probe
- Supports probes up to 4 GHz
- Easy firmware updates
- Wide variety of probes supported including: Preamplifiers, Current Probes, Single-Ended Active Probes and Differential Active Probes
- 100 MHz, 200 MHz, 350 MHz, 500 MHz and 1 GHz bandwidths
- Up to 4 GS/s sample rate
- Long Memory – up to 20 Mpts
- 10.1” capacitive touch screen display
- 16 Digital Channel MSO option
- MAUI - Most Advanced User Interface
- Designed for Touch
- Built for Simplicity
- Made to Solve
- Advanced Anomaly Detection
- Fast Waveform Update
- History Mode - Waveform Playback
- WaveScan - Search and Find
- Multi-Instrument Capabilities
- Protocol Analysis - Serial Trigger and Decode
- Waveform Generation - Built-in Function Generator
- Digital Voltmeter and Frequency Counter
- Future Proof
- Upgradeable Bandwidth
- Field Upgradable Software and Hardware Options
- Fully integrated smart vision system
- Mono and Color CCD sensor options
- Ultra small form factor 44 x 44 x 44 mm
- Industrial IP67 Housing
- Easy application setup via Laptop or PC
- M4 mounting holes on each surface
- Connects to standard vision lights
- Utilizes factory M12 style cordsets
- No software to install
- Uses standard PC Ethernet port & hardware
- Supports cable lengths up to 100 m (CAT-5e or CAT-6)
- Simplified set-up with field proven Sapera LT software featuring CamExpert
- Engineered to accommodate industrial environment with a ruggedized screw mount RJ-45 connector
- Highest resolution - 12 bits all the time
- Bigger Display, smaller footprint, most bench space
- More capability, increased productivity
- DigRF v4 Decodes
- Low-speed (26 Mb/s)
- Medium-speed (1248 Mb/s)
- High-speed (1456 Mb/s)
- DigRF v3 Decodes
- Low-speed (6.5 Mb/s)
- Medium-speed (26 Mb/s)
- High-speed (312 Mb/s)
- Convert DigRF 3G and v4 I and Q digital data to corresponding analog waveforms
- Correlate analog waveforms with protocol decode on one screen
- View decoded data in hexadecimal format
- Decode information expands as the time base is adjusted or zoomed
- Convenient table display with quick “Zoom to byte” capability
- Quick search capability for specific message packets
- S-parameters DC to 40 GHz, single-ended and mixed-mode
- Impedance Profile with <1 mm resolution, differential and common-mode
- Internal, automatic OSLT calibration
- USB-connected, small, lightweight
- Flexible display of the measurements
- Remove effects from fixtures, connectors and cables
- Emulate eye diagrams with CTLE, DFE and FFE equalization
- Advanced jitter analysis
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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