• Combine up to 12 fail-safe building blocks, dual SPDT, SP4T, SP6T, or transfer switch in a compact 1U footprint 
• Front “pluggable” relays facilitate field maintenance 
• Embedded web interface provides interactive utility to monitor and control relays from anywhere in the world 
• Flexible API supports IVI and Linux development environments minimizing software investment 
• LXI Trigger Event implementation provides seamless test synchronization with external devices 
• Store up to 128 relay state configurations for quick recall, including an automatic power up state 
• Define exclude lists to avoid setting an undesirable configuration 
• Relay odometer tracks closures to facilitate preventative maintenance

• This DCS Series Controller provides Lighting Control Flexibility in a slim 112 mm x 124 mm x 23 mm package. 
• Plug-n-Play compatibility with Ai lighting Products, featuring SignaTech™ technology. 
• Seamless switching from continuous-on to gated on/off and strobe overdrive; 3 independently configurable trigger inputs. 
• Din-rail mount, UL 508a Panel listed and GUI, Web Browser or command line setup and control tools, SDK. 
• 1 output, 3 channels – designed to drive multi-channel RGB / segment lights, as well as single higher current draw lights.

Our 2 Series cable assembly showcases excellent phase stability against bending, developed with microwave/mmWave measurement environments in mind.

Its flexibility means low repulsion, reducing the load on the measured object

See "Specifications & Details" tab for more information

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Solve machine vision applications efficiently by constructing flowcharts instead of writing program code, using field-proven tools for analyzing, classifying, locating, measuring, reading and verifying
• Use a single program for creating both application logic and operator interface
• Leverage deep learning for visual inspection through image classification and segmentation tools
• Rely on a common underlying vision library for the same results with an Iris GTX smart camera, vision systems or third-part computer
• Work with multiple cameras all within the same project or per project running concurrently and independently from one another, platform permitting
• Interface to Zebra AltiZ and third party 3D sensors to visualize, process and analyze depth maps and point clouds
• Communication options include discrete Zebra I/Os, RS-232, and Ethernet (TCP/IP, CC-Link IE Field Basic, EtherNet/IP, Modbus, OPC UA, and PROFINET, and native robot interfaces)
• Maximize productivity with instant feedback on image analysis and processing operations
• Receive immediate pertinent assistance through an integrated contextual guide
• Maintain control and independence through the ability to create custom flowchart steps
• Test communication with PLC using the built-in PLC interface emulator
• Protect against inappropriate changes with the Project Change Validator tool

Calibrating tuners for Network Analyzers presents challenges due to high reflections and low losses, affecting S-parameter measurements. At Focus Microwaves, we advocate for TRL (Thru-Reflect-Line) calibration as essential for precise results, unlike the less reliable SOLT and ECal methods. Our comprehensive TRL calibration kits cover 0.3 to 110 GHz and support connector types including 7/16, N, APC-7, 3.5mm, 2.9mm, 2.4mm, 1.9mm, WR-15, and WR-10. Compatible with all commercial network analyzers, these kits ensure reliability and accuracy, crucial for dependable VNA measurements.

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Reduce service stoppages with a fanless design
• Inspect multiple sites through the support for four GigE Vision and four USB3 Vision cameras
• Simplify cabling for GigE Vision installations using Powerover-Ethernet (PoE)-enabled ports
• Tackle deep learning and traditional machine vision applications with a mobile-class embedded twelfth-generation Intel Core processor
• Connect separately to the factory floor and enterprise networks via two more Gigabit Ethernet ports
• Synchronize with other equipment using the integrated real-time digital I/Os with rotary encoder support and RS-232/RS-485 ports
• Streamline application development using the Aurora Design Assistant flowchart-based IDE or the Aurora Imaging Library SDK
• Tackle machine vision applications with utmost confidence using field-proven tools for analyzing, locating, classifying, measuring, reading, and verifying