How to Become an Expert in Power Integrity Testing Webinar Series

Power Distribution Networks (PDNs) require careful design to ensure excellent power integrity, especially in high-speed designs. This 8-part series walks you through the fundamentals to advanced topics with a large number of live demonstrations.

Don’t Let Ground Bounce Ruin Your Day

In this session (Part 7), Dr. Eric Bogatin will focus on ground bounce. Ground bounce is a common problem in packages, connectors and circuit boards that gets worse with shorter rise times. This insidious problem can cause enough cross talk to break almost any product. We will look at the principles behind the root cause of ground bounce, how we can measure the ground bounce in your system, and based on the root cause, how we can design ground bounce out of your next product.

Topics to be covered in this webinar:

• What is ground bounce
• What interconnect features create ground bounce
• Measure ground bounce on a circuit board
• Measure ground bounce on the die and package
• Measure ground bounce from return path discontinuities

Who should attend? Hardware design and validation engineers and signal/power integrity engineers interested in expanding their knowledge on this very important topic.

What attendees will learn? By understanding the root cause of ground bounce you will see how to avoid it and ways to measure the cross talk between signal traces.

Presenter: Dr. Eric Bogatin, Teledyne LeCroy Fellow

Can't attend live? Register anyway, and we will send you the recording and slides afterward.