• Preparation of cable samples for further processing
• Applicable for cable types with solid core cross-sections
• E.g. Sample preparation for cutting with ORC family

• Device is according to the standard IEC 60811 -501, -507 (Heat elongation test, tensile test)
• Handy, electric device for material tests in laboratories
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)
• Especially for hard materials

• On-Off power switch
• 20 A Circuit Breaker
• Inlet - NEMA L6-20
• Outlets – NEMA L6-20R

• 3ft.
• (2) fork terminals (current)
• (1) fork terminals (ground)
• (2) Shielded Banana (voltage)

LUMIMAX® LED Ring Lights are ideal for the uniform illumination of flat, matte and reflective surfaces. A range of different sizes and performance classes of the LED ring light provide the optimum illumination for every application.

Lens exchange options, diffusers, Fresnel lenses and polarisation filters allow the optimisation of the radiation characteristic to the required inspection task – even at working distances of several meters. Calculate the optimal illumination area of the LR-series Ring Lights for your application easily and simply with the help of our practical tool.

Direct mounting on the camera or lens using optional accessories simplifies integration of the LED Ring Lights into Machine Vision systems.

With the LED Ring Lights of the BASIC series even price-sensititve applications can be reliably implemented.The focus here is on the realization of essential functions at high quality. A smart and lightweight design ease the integration in confined or moving machine vision systems.

Many EMC pre-compliance test setups require a ground plane. Not every lab has the necessary space for the permanent installation of a sheet metal ground plane.

The DigRF 3G and v4 decode are the ideal tools for powerful system level protocol debug as well as problem solving for signal quality issues. The DigRF decodes add a unique set of tools to your oscilloscope, simplifying how you design and debug MIPI digital RF systems.

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Specified performance to 43.5 GHz with Extended K™ ports
• Simple signal integrity testing of passive multiport and differential devices
• Wide dynamic range enables measurement of very low reflection artifacts
• Excellent corrected directivity minimizes measurement uncertainty
• SmartCal™ auto calibration unit reduces calibration and setup time
• Time domain with time gating option enables TDR-like measurements
• Modern LAN interface for remote control is faster than GPIB
• A common GUI and SCPI interface within the ShockLine family
• The compact 3U high chassis allows for the efficient use of rack space
• Bias tee option simplifies test setups where the DUT needs DC biasing
• Universal Fixture Extraction (UFX) software option provides advanced de-embedding tools for test fixture extraction