Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Device is according to the standard IEC 60811 -501, -507 (Heat elongation test, tensile test)
• Handy, electric device for material tests in laboratories
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)
• Especially for hard materials

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Accessories available, such as black bodies and optical motion analysis tools
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

Standard Tools

• Allen keys in several length
• Ring wrenches
• Jaw spanners
• Screw drivers
• Assembly pliers

Special Tools

• Adjustor for angle fine anjustment
• Spreading pliers for cable gland inserts
• Monting tool for front- and back lids

• Preparation of cable samples for further processing
• Applicable for cable types with solid core cross-sections
• E.g. Sample preparation for cutting with ORC family

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• 500 MHz - 4 GHz bandwidths 
• Up to 40 GS/s sample rate 
• 15.4” capacitive touch screen 
• MAUI with OneTouch 
• Powerful, Deep Toolbox 
• Exceptional Serial Data Tools 
• 16 digital channels with 1.25 GS/s 
• Huge Applied Offset Range 
• Optional Application Packages

• Robust and compact design, easy to handle
• Fast, reliable and highly accurate measuring process
• Integrated hardware and software, touch monitor for intuitive operationReliable, high-precision clamping of the test specimen (including conical tools / conical wire guides)
• The highly precise alignment of camera and test object chuck both enable a highly accurate measurement
• No extraneous light influences thanks to measuring behind closed sliding door