• 9 kHz to 9/14/20/26.5/32/43.5/54 GHz
• DANL: -164 dBm (with preamp)
• TOI: +20 dBm (typical) Analysis bandwidth: 150 MHz
• Amp range: DANL to +30 dBm
• Phase noise at 1 GHz: -110 dBc/Hz @ 100 kHz offset (typical)
• Demodulation: 5GNR, LTE FDD/TDD, RF, and modulation quality plus SSB signal analysis
• Resolution bandwidth (RBW): 1 Hz to 10 MHz
• Sweep Speed: 40 GHz/second (full span)
• RTSA bandwidth: 22, 55, 120, 150 MHz (option dependent)
• Amplitude accuracy: < 14 GHz ± 1.3 dB (± 0.5 dB, typical)
• Zero span with 60 ns minimum span
• IQ capture and streaming
• AM/FM modulation quality measurements
• Built-in PDF/HTML report generation
• EMF Measurements
• Uplink/Downlink interference analysis
• Interference hunting
• Channel Scanner
• Coverage Mapping

• Robust and compact design, easy to handle
• Fast, reliable and highly accurate measuring process
• Integrated hardware and software, touch monitor for intuitive operationReliable, high-precision clamping of the test specimen (including conical tools / conical wire guides)
• The highly precise alignment of camera and test object chuck both enable a highly accurate measurement
• No extraneous light influences thanks to measuring behind closed sliding door

• Industry Leading Power Density – Up to 1500 Watts in 1U 
• Standard Digital Interfaces – USB&RS232/485 
• LXI Ethernet and Isolated analog interfaces 
• Power Factor Correction-PFC and universal AC input 
• “Green” Sleep Mode – Automatically “sleeps” after period of non-use 
• Built in sequencing - Unload your system controller 
• Programmable fold-back protection delay

With the ProBus interface, the ZD500, 1000, and 1500 becomes an integral part of the oscilloscope. All probe gain and offset controls are transparent to the user, making it easier to probe the circuit without concern for which gain setting to choose. When used with a LeCroy digital oscilloscope, no external power supply is required.

• High Power Density: Up to 15 kW in 3U, 30 kW in a 6U chassis 
• Wide Voltage Range: 0-10V up to 0-1000V, from 4 to 30 kW 
• Fast Load Transient Response: Protection from undesired voltage excursions 
• Low Ripple and Noise 
• Intuitive Touch Screen Display 
• Parallelable up to 150 kW 
•  Sequencing: Free system controller & speed up test 
• Low audible noise: Temperature controlled variable speed fans

• Device is according to the standard IEC 60811 -501, -507 (heat elongation test, tensile test)
• The samples are taken from the inner side of the sheath and isolator
• All grooves and/or conductive layers are removed
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)

• Device is according to the standard IEC 60811 -501, -507 (Heat elongation test, tensile test)
• Handy, electric device for material tests in laboratories
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)
• Especially for hard materials

Flexibility

• Different substrate carriers for wafers up to 150 mm or single dies
• Up to six positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Probing with an open chamber lid possible under atmospheric condition
• Specially designed for laboratory environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features