• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• High power density in 4U/14U chassis up to 36 kVA.
• Intuitive touch panel control.
• iX2™ current doubling technology.
• Multi-language user interface for global operation.
• Auto paralleling for higher power.
• Combine units for multi-phase configurations
• Complete optional avionic test suites.
• ATE version available

• Protocol reports
• Generation of waveforms with synchronous data acquisition
• Modular Expandable
• Individual Waveform Generation
• Standard Libraries included
• Unlimited Waveform size
• 2 different Waveforms synchronously
• DLL's for LabView, Vector CANoe / CAPL, C#, C++, ANSI C, Python, etc.
• Simulation of imported oscilloscope waveform

The industrial manufacturing industry has been a sector of constant innovation for centuries, continuously leveraging the data from frequent iterations to achieve new solutions. This is no different today, driven by advancements in automation, the adoption of Industry 4.0 technologies, the integration of IoT, and the shift towards sustainable manufacturing practices. These trends require the development of new testing protocols, thorough safety standards, and sophisticated quality control measures to ensure the reliability and efficiency of increasingly complex systems. Manufacturers must also address interoperability and cybersecurity challenges posed by interconnected devices and digital supply chains. Add the push for eco-friendly, sustainable manufacturing practices in conjunction with rigorous testing for compliance with environmental regulations, and achieving balanced testing facility solutions is no easy task.

Food and beverage technology is changing the global food and beverage industry from production to delivery. Consumer and market demand for sustainable and healthy products also means stricter regulations that promote safe consumption, sustainable package production, and effective recycling or disposal. These trends add up to a heightened demand for organizations in the industry to commit to testing protocols that ensure food safety, quality, and compliance with evolving standards. Facilities and manufacturers face challenges such as implementing advanced traceability systems, ensuring the safety and efficacy of new ingredients and packaging materials, and adhering to rigorous environmental regulations. Additionally, the rise of automation and digitalization in food production results in new challenges related to interoperability and cybersecurity. Testing facilities must adapt swiftly to support R&D efforts, ensuring the safe, efficient, and compliant production of innovative food and beverage products in a rapidly changing market landscape.

The DigRF 3G and v4 decode are the ideal tools for powerful system level protocol debug as well as problem solving for signal quality issues. The DigRF decodes add a unique set of tools to your oscilloscope, simplifying how you design and debug MIPI digital RF systems.

• The Wide Linear Diffuse Light series is ideal for the inspection of elongated or cylindrical objects. 
• Perfect for inspections requiring a multi-camera setup. 
• Can be provided with up to 4 viewing ports. 
• Expandable lengths from 6” – 36” (152 – 194mm) in 6” increments.

• First commercial high-performance cesium atomic clock using optical pumping — 100 times more atoms can be measured compared to magnetic clocks.
• Offers 10 times higher clock stability.
• Double the operational lifetime compared with traditional magnetic cesium clocks.
• Wide range of ultra-low noise frequency outputs (e.g. 5 MHz, 10 MHz, 100 MHz) — plus multiple 1PPS outputs, supporting high-precision timing distribution.
• Frequency accuracy ≤ ±5 × 10⁻¹³; reproducibility after power cycle ≤ ±1 × 10⁻¹³.
• Adjustable frequency offset: resolution ±1 × 10⁻¹⁵, range ±1 × 10⁻⁹.
• Rack-mount (3RU, 19″)

• High Intensity: up to 9x brighter than the existing SL191 Pattern Projecting Spot Light and more than 3x brighter than the leading competitive structured light projector. 
• Projection patterns are easily configured with available reticles, including line, grid, cross, multiple lines, and half sphere, with custom reticles available. 
• Customizable: available in multiple wavelengths, including white. 
• Constructed with a large heat sink for improved LED thermal management to facilitate increased brightness while maintaining safe operating temperatures. 
• Ideal solution for machine vision inspection applications requiring structured illumination, including edge detection, locating offsets, and assessing topography. 
• Requires a reticle and lens (sold separately); see available reticles here.