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Trenton Systems - Multi-Node Servers
Secure and compact servers with multiple fixed segments made right here in the USA that maximize performance and adaptability for evolving applications.
- Size - Multiple within a single rugged enclosure help efficiently utilize rack space.
- Weight - Compact system design reduces overall weight of rack server infrastructure.
- Power - Shared resources optimize hardware usage and limit power requirements.
- Cost - Increased compute footprint lower hardware and maintenance costs.
Technical Features
- 1U - 2U Form Factors
- PCIe 2.0/3.0 slots
- Up to 12x DIMM slots
- Internal/removable SSDs
- Intel Xeon®, Core® CPUs
Compute density. Redefined.
Greatly consolidate workloads while reducing footprint and hardware costs with multiple single- or dual-CPU segments in one chassis. Each processor can run a separate application.
More Product Information
The SMP3xxx product family is made up of the SMP3001, SMP3001DS, SMP3002, SMP3005, SMP3620 (pictured), and SMP3625.
- Support for the highest speeds available in CoaXPress 2.0
- Connect to and capture from up to four cameras or combine connections for even higher data rates
- Simplify cabling with PoCXP support between cameras and vision computer
- Offload host computer of custom image processing using a field-programmable gate array (FPGA) device
- Distribute image processing workload across multiple computers through data forwarding capability
- Synchronize with sensors, encoders, and controllers with ample auxiliary I/Os for each CoaXPress connection
- Use license fingerprint for Aurora Imaging Library and avoid the need for a separate hardware key
- Monitor and troubleshoot acquisition performance in detail using Aurora Gecho event-logging tool
- 96 digital lines configurable as either input or output
- Five available power supply rails for custom designs
- Mix and match with standard SMIP switching and digital I/O modules to create high density configurations
- VXIplug&play driver simplifies software development
- On-board connector header for simplifed migration to PCB implementation
- Access to 16 MHz clock for use in complex designs
- Multiple front panel connector options
- Robust, vibration-proof assembly without own manufacturing effort
- Flexible alignment with multiple degrees of freedom
- Can be endless combined and expanded
- Easy attachment to T-slot profiles or other structures
- Variable length up to one meter for a unit price
- Cost and time savings thanks to prefabricated components
- Single system power up to 650 kW Parallel system power up to 1.3 MW
- Output voltage up to 1,000 V
- Bidirectional output current up to ±1,000 A, up to ±2,000A in parallel
- Available in 1, 2 or 4 channel configurations
- Multiple channel units share internal DC Bus up to 2MW without drawing additional power from the AC Grid
- Regenerative to 96%
- Large 15-inch color touch panel
- Short circuit proof
- Designed for safety to EN ISO 13849-1
- Dedicated Battery Testing/Simulation Modes
- Seamless transition between source and sink
- High reliability, long life components
- Dual Voltage ranges that support over-voltage testing on 480V-based systems
- Separate terminal blocks for single-phase and three-phase AC power supply outputs
- High Power AC and DC Source
- Auto paralleling for higher power system expansion
- Single and three-phase modes
- Arbitrary & Harmonic Waveform Generation
- Standard LXI LAN, USB, and RS-232, Optional GPIB
- Step, list, and pulse voltage transients with down to 500usec resolution
- Complete avionics power quality test suites
- 15kVA to 1MVA Power Levels
- Intuitive 5” color display for ease of navigation
- Internationally accepted test routines for EMI/EMC, Safety Compliance
The DigRF 3G and v4 decode are the ideal tools for powerful system level protocol debug as well as problem solving for signal quality issues. The DigRF decodes add a unique set of tools to your oscilloscope, simplifying how you design and debug MIPI digital RF systems.
- Easy replacement of essential components by the customer in the field with a downtime of less than 1 hour
- Intuitive API for easy integration with customer software and existing systems
- Standardized power and network components avoid additional costs
- Optimized for working areas up to 10 m x 10 m and projection distances up to 15 m
- Adjustable focus enables precise projections at different distances and on different surfaces
- Accuracy of better than +/- 0.25 mm/m for highly precise results
- Fine 3D line quality even at high projection distances ensures visible and clear projections
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
Trenton Systems
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Founded in 1989, Trenton Systems provides the defense, government, industrial, and commercial markets with advanced, TAA-compliant high-performance computing solutions designed in consultation with customers. Equipped with the latest processing, AI/ML/DL, networking, security, and storage technologies, our solutions are designed in collaboration with our global partnership ecosystem.
