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Trenton Systems - Multi-Node Servers
Secure and compact servers with multiple fixed segments made right here in the USA that maximize performance and adaptability for evolving applications.
- Size - Multiple within a single rugged enclosure help efficiently utilize rack space.
- Weight - Compact system design reduces overall weight of rack server infrastructure.
- Power - Shared resources optimize hardware usage and limit power requirements.
- Cost - Increased compute footprint lower hardware and maintenance costs.
Technical Features
- 1U - 2U Form Factors
- PCIe 2.0/3.0 slots
- Up to 12x DIMM slots
- Internal/removable SSDs
- Intel Xeon®, Core® CPUs
Compute density. Redefined.
Greatly consolidate workloads while reducing footprint and hardware costs with multiple single- or dual-CPU segments in one chassis. Each processor can run a separate application.
More Product Information
- Support the most high-performance Camera Link cameras with available support for Full and 80-bit mode at up to 85 MHz
- Perform deterministic image acquisition by way of the jitter-free Camera Link 2.1 interface
- Offload host computer of custom image processing using a field-programmable gate array (FPGA) device
- Eliminate missed frames through a PCIe® 2.0 x8 host interface and ample onboard buffering
- Optimize multi-camera applications via support for up to four Base or two Full/80-bit Camera Link cameras per board
- Minimize space requirements and maximize PC compatibility through a half-length design with mini Camera Link connectivity for true single-slot operation
- Improve and simplify system connectivity with Power-overCamera-Link (PoCL) support at extended cable lengths
- Pre-Engineered Scalability Enables Customized Emitting Lengths in 2″ Increments to 20″
- Intense, Diffuse Lighting with 226 kLux at Emitting Surface
- Multiple Available Wavelengths, Including Visible Monochromatics, Infrared, and White
- Available Washdown Option for Difficult Environments
- Can be Applied in Backlighting or Diffuse Front Lighting Geometries
- Redundant design with multiple signal paths built in for high-availability.
- 12 expansion slots in the 2U version and 5 expansion slots in the 1U variant.
- Industry-first GPS integrity checking
- Unique optical crosslink architecture for either Master-Slave hierarchical setups or Master-Master crosschecking and failover
- 2U version is operated by an intuitive touch-screen interface, a first for any master clock system.
- All components are hot-swappable and are dual redundant.
- The Output Signal modules are hot-swappable from the front and minimize the need to disconnect cables.
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
- Three independent, isolated 1700W DC outputs, 5100W total
- 1U rack-mount chassis
- 9 output options
- Multi-language, intuitive, color touch panel control
- Global 3-Phase AC Input options for system phase balancing
- Active power factor correction (PFC)
- Multi-channel programmable sequencing, ramps, and delays
- Full remote control via Virtual Panelsâ„¢ GUI
- Standard LXI Ethernet, USB, and RS232 control interfaces
- Optional GPIB control interface or isolated analog programming
Food and beverage technology is changing the global food and beverage industry from production to delivery. Consumer and market demand for sustainable and healthy products also means stricter regulations that promote safe consumption, sustainable package production, and effective recycling or disposal. These trends add up to a heightened demand for organizations in the industry to commit to testing protocols that ensure food safety, quality, and compliance with evolving standards. Facilities and manufacturers face challenges such as implementing advanced traceability systems, ensuring the safety and efficacy of new ingredients and packaging materials, and adhering to rigorous environmental regulations. Additionally, the rise of automation and digitalization in food production results in new challenges related to interoperability and cybersecurity. Testing facilities must adapt swiftly to support R&D efforts, ensuring the safe, efficient, and compliant production of innovative food and beverage products in a rapidly changing market landscape.
The industrial manufacturing industry has been a sector of constant innovation for centuries, continuously leveraging the data from frequent iterations to achieve new solutions. This is no different today, driven by advancements in automation, the adoption of Industry 4.0 technologies, the integration of IoT, and the shift towards sustainable manufacturing practices. These trends require the development of new testing protocols, thorough safety standards, and sophisticated quality control measures to ensure the reliability and efficiency of increasingly complex systems. Manufacturers must also address interoperability and cybersecurity challenges posed by interconnected devices and digital supply chains. Add the push for eco-friendly, sustainable manufacturing practices in conjunction with rigorous testing for compliance with environmental regulations, and achieving balanced testing facility solutions is no easy task.
SCANBOOSTER II
- controller for Embedded Testing and Programming
- high flexibility through multifunctional I/O channels for mixed-signal tests ·
- modularity and scalability due to configurable TAP Interface Cards
- integrated compact unit controllable via USB 2.0 and GBit-LAN
PicoTAP ATE
- Controller for embedded testing and programming
- Low-cost module with high performance and multifunctional architecture
- available in a housing or as a PCBA for spacesaving installation in the test system
- integrated compact unit controllable via USB 2.0
- Global shutter and rolling shutter CMOS sensors available
- USB3 Vision
- High sensitivity with both front and back illuminated sensors (BSI)
- Side mounted USB connectors for ease of use in OEM solutions
- High sensitivity with pixel sizes from 2 µm to 3.45 µm
- Windows operating system and Linux SDKs (for embedded vision systems)
- 3-Year Warranty
Trenton Systems
Website
Founded in 1989, Trenton Systems provides the defense, government, industrial, and commercial markets with advanced, TAA-compliant high-performance computing solutions designed in consultation with customers. Equipped with the latest processing, AI/ML/DL, networking, security, and storage technologies, our solutions are designed in collaboration with our global partnership ecosystem.
