UV curing is a photopolymerization process in which UV energy is used to solidify liquids. UV LED curing systems are now the technology of choice across a wide range of applications including printing, 3D printing, coatings, and adhesives due to the inherent value of an LED solution. They offer vastly improved lifetimes, reduced maintenance costs, significant energy savings, and with no ozone emissions or mercury content, offer more benefits than traditional technologies. In addition, the “cold cure” offered by LED-based systems is ideal for heat-sensitive substrates or thin films.

• Lithographic thin-film construction
• Excellent crosstalk characteristics
• Non-oxidizing nickel alloy tips
• Innovative force delivery mechanism
• 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
• GSG, SG, GS, GSGSG, GSSG, SGS configurations
• 50 to 250 µm pitches (other pitches available on request)
• High current version (2 A) available

Advantages

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

Simulator to reproduce various transient surge phenomena which are generated in a vehicle and required in the international standard ISO-7637-2 (2004) Standard, and evaluate the immune resistibility of the equipped electronics devices against the surge. 

• ISO 7637-2 (2004) Standard compliant simulator 
• Correspondent to the test for 12V/24V/42V systems in a vehicle 
• Stand-alone usage per the each generator unit possible as well as the comprehensive control 
• Large capacity CDN (60V/50A) available (Option) 
• Up to 200A power supply possible (Option) 
• Windows in Japanese applicable for the software program as well

_{Private standards or specifications by manufactures can be responded upon request.}

• IEC 61000-4-4 Ed.3 standard compliance. 
• Pre-check function is installed. Inspection before testing is now easy. 
• Normal mode test support. Taking account of field troubles is possible. (option) 
• Utilize an outlet box that simplifies EUT connection. (option) 
• Compared with conventional products, the size has become compact. (Approximately 67% by volume) 
• Easy to understand Panel display reduces mistakes in connecting power cables. 
• Software control with Windows. (option) 
• Next calibration date can be notified. (Windows software only) 
• Employ LCD screen with multi-language support and enhanced operability. 
• Maximum output voltage of 5 kV and maximum pulse frequency of 2 MHz allow you to test above the standard test level. 
• CDN capacity is increased to single phase type AC 240 V 20 A, single and three phase type to AC 600 V 63 A, supporting wider range of EUT. 
• Large capacity CDN (100 A or 150 A) option available for Injection test on various EUT. 
• Using coupling clamps, EMS probe kits, you can test the signal lines and evaluate the noise immunity on the PCB. (option)

AI, cloud computing, and hyperscalers are accelerating the demand for ultra-high-speed, low-latency connectivity, taking us past Gigabit Ethernet and into the era of Terabit Ethernet.

Teledyne LeCroy’s Terabit Ethernet solutions are engineered to help you take full advantage of this new technology cycle. The Xena Ethernet Test Platform gives developers of semiconductor, NEMs, and hyperscalers the solutions they need to validate next-gen silicon, network devices, and interconnects with confidence.

From Layer 1 signal integrity and Layer 2 traffic generation and analysis, we have the solutions you need to simulate, stress, and certify real-world performance. Support for 224Gbps electrical lanes, advanced FEC, and PCS diagnostics ensure readiness for tomorrow’s networks. Compact, desktop-friendly hardware combined with intuitive software and powerful automation ensure seamless lab-to-production workflows.

Whether you’re path-finding 1.6T or optimizing 800G deployments, Xena can fast-track your innovation cycle. Test smarter, deploy faster and reap the rewards.

• Outstanding stability
• Fast switching speed
• Ripple-free response over standard waveguide bands

The NC5000A Series AWGN noise sources feature outstanding stability, switching speed, and ripple-free response over standard waveguide bands. The high stability of the NC5000A Series allows these units to be used in place of cumbersome gas tube noise sources.

Ripple in the output of noise sources has a direct effect on measurement accuracy, so Noisecom has tailored the response of the NC5000A Series so that ripple is minimized throughout the specified frequency range.

The TEM horn antenna is an antenna used for conducting close proximity radiation immunity evaluation test (near electromagnetic field immunity test) of electromagnetic waves radiated from various wireless transmitters such as mobile devices. 

In the future, close proximity radiation immunity evaluation test using the TEM horn antenna is expected to expand to various product standards such as medical equipment (IEC 60601-1-2) and multimedia equipment (CISPR 35).NoiseKen's TEM horn antenna has a wide band, low VSWR, and wide electric field uniformity offering an ideal solution for an efficient close proximity radiation immunity test. 

• A TEM horn antenna compliant with IEC 61000-4-39 Ed.1. 
• Test without changing the antenna in the frequency range of 380MHz to 6GHz. 
• Low VSWR and high GAIN enable efficient electromagnetic wave radiation. 
• Wide field uniformity reduces the number of times of movement of the antenna when radiating the EUT. 
• Since the maximum point of the near electric field distribution for each frequency is at the center, enables radiation on the EUT based on the axis of the antenna. Hence, significantly simplifies test point alignment.

The SMP3xxx product family is made up of the SMP3001, SMP3001DS, SMP3002, SMP3005, SMP3620 (pictured), and SMP3625.