Teledyne DALSA - Firefly S Ultra Compact and light USB3 camera
- Small, Light, and Low Power - Ideal for embedding into compact, hand-held and portable devices with a footprint of 27 mm x 27 mm x 14 mm, 20 gram weight and 2.2 W power consumption.
- Core Machine Vision Capabilities - Essential machine vision features including GPIO, triggering, and partial image modes.
- Exceptional Value - Get access to the latest global shutter CMOS sensors at low starting prices of just $199 USD.
The Teledyne FLIR Firefly® S camera delivers the essential machine vision features you need in an ultra-compact body. Its small size, low power, and light weight make it ideal for embedding into portable devices. The Firefly S camera provides amazing value by combining powerful on-camera features with the latest CMOS sensors.
Models
|
Model Number |
MP |
FPS |
Sensor |
Spectrum |
|---|---|---|---|---|
|
0.4 |
121 |
Sony IMX297 |
Mono |
|
|
0.4 |
121 |
Sony IMX297 |
Mono |
|
|
0.4 |
120 |
Sony IMX297 |
Color |
|
|
0.4 |
120 |
Sony IMX297 |
Color |
|
|
0.4 |
120 |
Sony IMX297 |
Color |
|
|
0.4 |
120 |
Sony IMX297 |
Mono |
|
|
1.6 |
60 |
Sony IMX296 |
Color |
|
|
1.6 |
60 |
Sony IMX296 |
Color |
|
|
1.6 |
60 |
Sony IMX296 |
Color |
|
|
1.6 |
60 |
Sony IMX296 |
Mono |
|
|
1.6 |
60 |
Sony IMX296 |
Mono |
|
|
1.6 |
60 |
Sony IMX296 |
Mono |
More Product Information
The FLIR Blackfly S Board Level variants are high performance, machine vision, area scan cameras designed for embedding into tight spaces. Unlike many board level cameras, it boasts a rich feature set applied to the latest CMOS sensors; the same feature set as the cased version. It is ready for integration with proven compatibility with popular SBCs and SOMs. The Blackfly S board level models enable OEMs to develop smaller, lighter, and lower cost solutions with embedded system connectivity and rich features.
The Blackfly S currently has a lead time of four weeks or less. Get the cameras you need – when you need them.
- Static power analysis - like a dedicated power analyzer
- Dynamic power analysis – capture more information
- Complete test coverage – control system, power section, motor
- Comprehensive mechanical interface
- Harmonics calculation option
- Vector display option (THREEPHASEVECTOR)
- Waveform Transformations option (THREEPHASEdq0)
- 16 Channels with OscilloSYNC™
-
HD4096 technology provides 12-bit resolution up to 8 GHz and 20 GS/s
-
Up to 5 Gpts of acquisition memory enables detailed viewing of long events
-
15.6" 1900 x 1080 Full HD capacitive touchscreen
-
New ProBus2 input supports up to 8 GHz bandwidth and direct compatibility with a wide variety of existing ProBus probes - 50Ω and 1MΩ coupling modes support all input types on a single connector
-
MAUI with OneTouch user interface for intuitive and efficient operation
-
Deep toolbox enables and simplifies complex analysis
-
Intuitive navigation to quickly find important features in long waveforms
- Up to 4 GHz Bandwidth
- ±60 V Offset Capability
- ±800 mV Dynamic Range
- 50 kΩ DC Input Impedance
- 1.2x Attenuation for low additive noise
- MCX terminated cable with wide variety of connections:
- Solder-in (4 GHz)
- Coaxial Cable to U.FL receptacle (3 GHz)
- MCX PCB Mount (4 GHz)
- Browser (500 MHz)
- ProBus Interface
- 2,048 pixels CMOS monochrome line scan sensor
- Pixel size available in 2 versions: 10 μm x 20 μm and 10 μm x 200 μm
- Pixel full well capacity available in two versions: 140 ke- and 200 ke-
- CameraLink (base, medium, full) or USB3 interface
- Line rate available in 4 versions: up to 20 kl/s, 80 kl/s, 130 kl/s and 250 kl/s
- Bit depth: 10, 11 and 12 bits • Configurable region of interest
- Sensor package available in two versions: ceramic and organic
- Power supply: 10 to 15V DC. PoCL compliant
- Low power consumption: <3W
- Available in 30MHz, 40MHz, 60MHz, 80MHz, 120MHz, 200MHz, 350MHz and 500MHz models
- All models feature 2 channels
- Max Sampling rate of 150 Msa/s (30MHz & 60 MHz) 1.2 Gsa/s (40MHz, 80MHz, 120MHz) and 2.4 Gsa/s (200MHz, 350MHz and 500MHz) models.
- Up to 16-bit vertical resolution (14-bit on 30MHz & 60MHz models).
- All models have 4.3" Touchscreens.
- Excellent analog and digital modulation types available (AM, DSB-AM, FM, PM, PSK, FSK, ASK and PWM)
- Extended Spectral Range
- Capture images from visible light to SWIR (400 nm to 1700 nm) and enhance detection and analysis across various materials and applications.
- Compact and Balanced Design
- The compact housing balances image performance and size. It is ideal for space-constrained environments without compromising image quality.
- GigE Performance and Reliability
- GigE driver performance with the Spinnaker® SDK, Sapera™ Processing, and a powerful Trigger-to-Image Reliability (T2IR) framework.
- Up to 65 GHz
- Up to 80 Channels @ 36 GHz
- Up to 160 GS/s
- Up to 512 Mpts/Ch
- 50 fs rms Sample Clock (Intrinsic) Jitter
- Jitter Between All Channels of <130 fs rms
-
Monochrome (G-131B) and color (G-131C) models
-
GigE Vision interface with Power over Ethernet
-
Screw mount RJ45 Ethernet connector for secure operation in industrial environments
-
Supports cable lengths up to 100 meters (CAT-6 recommended)
-
Comprehensive I/O functionality for simplified system integration
-
Popular C-Mount lens mount
-
Easy camera mounting via standard M3 threads on top and bottom of housing or optional tripod adapter
-
Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
-
Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
-
Select between B 270 ASG protection glass and filter types: Jenofilt 217 IR cut filter, Hoya C-5000 IR cut filter, RG715 IR pass filter, or RG830 IR pass filter
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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