Webinar
Teledyne LeCroy: Understanding Signal Integrity Problems in USB Type-C® and HDMI® 2.1 Cables
Do you work for or with a company that does high-volume production of USB Type-C and HDMI 2.1 cables?
If so, how do you perform quality assurance assessments on sample cables, engineering first article inspections, or root-cause failure analysis?
Join Professor Eric Bogatin as he describes how to go beyond production cable tests and use advanced signal integrity tests, such as eye diagrams, insertion loss and crosstalk measurements, and impedance profiles, to understand why cables are failing production test or to understand how much margin there is in the cable design. Eric will demonstrate how to do all of this without using an expensive oscilloscope, vector network analyzer (VNA) or TDR.
Topics to be covered:
- Typical failures in cables
- Eye diagram – what is it and what does it tell us?
- How to interpret a TDR response
- How to interpret an insertion loss and impedance profile measurememt
- How to identify the root cause from its measured signature
Who should attend? Quality Assurance Managers, Cable Design Engineers, Manufacturing Engineers, and Production Supervisors at companies that produce USB Type-C and HDMI 2.1 cables
What attendees will learn? How to improve assessment of failed cables and determine and understand how to improve the cable design to improve production yield and lower production cost.
Presented by: Eric Bogatin, Teledyne LeCroy Fellow and Professor, ECEE Univ of Colorado, Boulder