Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.

The industrial manufacturing industry has been a sector of constant innovation for centuries, continuously leveraging the data from frequent iterations to achieve new solutions. This is no different today, driven by advancements in automation, the adoption of Industry 4.0 technologies, the integration of IoT, and the shift towards sustainable manufacturing practices. These trends require the development of new testing protocols, thorough safety standards, and sophisticated quality control measures to ensure the reliability and efficiency of increasingly complex systems. Manufacturers must also address interoperability and cybersecurity challenges posed by interconnected devices and digital supply chains. Add the push for eco-friendly, sustainable manufacturing practices in conjunction with rigorous testing for compliance with environmental regulations, and achieving balanced testing facility solutions is no easy task.

Focus’ modular microstrip, high power and ultra low loss coaxial  RF Test Fixtures are designed mainly for load pull testing of packaged transistors. All Focus test fixtures come with TRL calibration standards and support most transistor packages sized from less than 0.1″ and up to 1″.

Connectors in the 0.9 mm SuperMini product line provide the superior performance of Southwest Microwave’s standard-size, high frequency connectors in a miniaturized footprint that is ideal for reduced-size PCB and panel applications, offering ultra-broad bandwidth and coupling nut mating. 0.9 mm SuperMini connectors are rugged and durable, featuring a 360° raised grounding ring and a temperature range of -55°C to 165°C. These connectors provide mode-free operation through 67 GHz, offering well-matched impedance, excellent repeatability, and the industry’s lowest VSWR (1.2:1), insertion loss (0.7 dB) and RF leakage (≤ -100 dB).

• 4 Independent Channels 
• 1Ω Resistance Increments 
• Precision Sensor Simulation Capability 
• Low Thermal Offset 
• Independent Sense Feedback 
• Parallel and Series Operation 
• Dynamic Soft Front Panel 
• IVI-COM, IVI-C, LabVIEW™ Drivers 
• Monitoring the Set Values Without Disconnecting Channels Connections 
• 3-Year Warranty

Configurable and SWaP-C optimized with maximum storage capacity, processing power, and intelligence, our ruggedized, TAA-compliant BAM servers are the perfect solutions to accelerate and sustain ever-evolving applications

• Leading Performance CPUs - Supports dual Intel® 3rd Gen Xeon® SP CPUs with hardware-based encryption for enhanced compute and networking.
• High-end GPUs and FPGAs - Supports multiple double-wide, high-end Intel® and NVIDIA® GPUs and FPGAs to accelerate AI/ML/DL workloads at the edge.
• Fast NVMe SSDs - Supports up to 8 high-speed NVMe or 9 SAS/SATA SSDs to increase read/write speeds (FIPS 140-2/3 available).

AR E-field generators offer exceptional uniformity between the elements. Our ATE10K30M uses low inductance high-power internal load resistors to terminate RF power, and offers well-matched input VSWR. The ATE10K100M is our own patent-pending folded-dipole type design. And we haven’t yet found a test object the ATE10K25M–1 can’t handle.