Test & Measurement
Embedded
Products
SuperMini Board-to-Board solutions optimize interconnect performance for board-to-board stacking applications.
Available bullets enable board-to-board spacing as close as 3 mm, assuring transmission line dependability for tightly stacked PCBs. Low mating insertion force allows for an increased density of interconnections per board. Unique bullet design enables extended mating and de-mating cycles.
For microstrip or grounded coplanar waveguide (GCPW) designs, Southwest Microwave solderless vertical launch connectors provide optimal signal integrity and are reusable. Suitable for various board materials and thicknesses, the vertical launch connectors reduce footprint requirements without sacrificing performance, resulting in design and installation convenience.