Embedded computing systems are rapidly increasing in power densities, making thermal solutions a major design concern. In most cases, designers prefer a predominantly conduction cooled approach, which provides the highest reliability.

ACT’s Isothermal Card Edge, or ICE-Lok™ wedgelocks, are designed to enhance card-to-chassis conduction by enhancing the heat flow through the wedgelocks by making additional contact between the card and the chassis. Learn more about ICE-Lok™ and see how it is utilized to improve thermal efficiency in embedded computing systems. ICE-Lok™ is a patented product. Copyright ACT 2018. All rights reserved.