Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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Products
The PI-MAX 4 improves time-resolved imaging and spectroscopy with either intensified CCD (ICCD) or intensified EMCCD (emICCD) systems. With a wide range of applications, such as plasma diagnostics, combustion and quantum computing, there is no other ICCD that can match the performance and flexibility of the PI-MAX 4.
Large format, fully in-vacuum CCD cameras, offering flexible detector orientation and proximity to sample through sensor and camera design. With back-illumination technology, the PI-MTE3 delivers >95% peak quantum efficiency over the ~10 eV to 30 keV energy range. Efficient liquid cooling offers low dark current, facilitating long exposure times, with the four-port readout architecture offering 7-10x higher frame rates than previous generation two-port cameras.
- High speed 120 kHz, high resolution 28 μm or 900 dpi
- No missing or interpolated pixels
- Exposure control
- Mono/HDR mode
- Precalibrated pixel size for metrology applications
- Camera Link HS fibre interface
- ~120-1100 nm sensitivity
- -90℃ deep cooling
- Support for CCDs of varying sizes
- Flexible readout design
PIXIS-XB thermoelectrically cooled, direct-detection cameras are ideal for the energy range ~3 – 20 keV. Available with front- back-illuminated, deep-depletion arrays and a thin beryllium window sealing the vacuum unit for deep cooling. This protects the CCD and reduces background by filtering low-energy x-rays.
PIXIS XF low-noise cameras have a unique fiberoptic design with multiple phosphor screen options for the direct detection of x-rays. With an exclusive mechanical design, where the fiberoptic faceplate extends outside the vacuum, the PIXIS XF offers flexibility for optimizing performance at specific medium-energy x-rays.
PIXIS-XO highly sensitive, thermoelectrically cooled cameras utilize various back-illuminated CCDs without antireflective coating for direct detection of x-rays. A rotatable ConFlat flange with a high-vacuum-seal design make these cameras well suited for UHV applications.
- World’s first backside illuminated CMOS sensor
- 95% quantum efficiency
- 82 frames a second
- Large 11 μm pixels
- Low 1.6 e- read noise
- Multiple field of view options: 18.8 mm, 22 mm, or 25 mm
- Large full well capacity, can handle intense signal levels
- High dynamic range