Product Finder
Displaying 1 - 18 of 18
 FormFactor - Akari - Multi-site and single-site cards for LED testing
Long life probe over 15M touch downs on gold pads
Accurate tip positioning enables pad size reduction, allowing more die per wafer for higher throughput, and more... |
 FormFactor - Altius - Enables test of high performance very large I/O logic devices with fine pitch micro-bumps
Minimum grid-array pitch of 45 µm
Ultra-low probe force for direct probing on copper through silicon vias or solder microbumps, ~1 gram per probe at... |
 FormFactor - Apollo - Designed for fine-pitch flip-chip applications with high current carrying capability - copper pillar and solder bumps
Broad range of vertical and vertical MEMS probe options, scalable to 80 um pitch
Proprietary manufacturing technology for reduced Cres and improved wafer yield... |
 FormFactor - Cantilever - Wafer test probe cards for fine pitch, wire bond logic devices
Supports 40 um pitch, 20/40 um staggered design
Short-beam option for high speed testing, up to 3 GHz @-3 dB
Uniform scrub performance for... |
 FormFactor - Genus - 300 mm NAND Flash Probe Card Architecture
Increase throughput to test in excess of 35,000 probes
Test speeds of 125 MHz capable
Scalable 2D MEMS MicroSpring™ technology enables... |
 FormFactor - HFTAP Series - High Frequency Test at Probe
K32 (up to 3.2 GHz/6.4 Gbps) high-speed test capable at wafer level
Supports advanced packaging requirements for at speed testing
Enables testing... |
 FormFactor - Hikari - CMOS image sensor probe card
Optimized array configuration with parallelism for fewer touchdowns – industry’s first x32 and x64 arrays in production
Small scrub mark over wide... |
 FormFactor - Kepler™ - High parallelism vertical probe card for large active area
Thermally stable vertical spring architecture to support wide temperature range of automotive test requirement
Excellent XYZ tip position performance... |
 FormFactor - PH Series - For integrated, wafer testing with probe head sizes ranging from 50 mm to 100 mm
3D MEMS MicroSpring contact design with high pin count and small pad size capability
Wide temperature compatibility for more controlled probing and faster setup,... |
 FormFactor - Pyramid Accel Test Fixture Probe Card
Excellent signal integrity, all the way to the package DUT pin.
Multi-DUT capability enables faster debug of complex test programs.
Compatible... |
 FormFactor - Pyramid Calibration Substrate
Ability to match DUT layout improves RF calibration for better yield
Reduced site-to-site variation in probe cards eliminates the need for correlation... |
 FormFactor - Pyramid Parametric Probe Card
Guarded traces to probe tips with lowest leakage
Excellent measurement fidelity with low leakage (1 fA/V), fast settling time, and reduced cross talk... |
 FormFactor - Pyramid RF - High-performance RF probe card for wireless RF and microwave production test
High-bandwidth RF microstrip transmission lines to probe tips guarantee performance and ensure low signal loss.
Patented ground and power planes, with bypass... |
 FormFactor - Pyramid-MW Probe Card
Ship high-yield KGD: Consistent low contact resistance and low-inductance probe tips ensure accurate and repeatable mmW RF measurements.
Stable DUT operation:... |
 FormFactor - QiLin - For advanced wafer-level chip scale packaged (WLCSP) devices with a pitch range of 250-500μm
Broad range of spring pins options for targeted application, with pitch ranging 250 – 500 um
Variety of tip materials for maximum lifetime... |
 FormFactor - SmartMatrix - Full-area 300-mm wafer testing for advanced devices
Higher parallelism, higher test efficiency, and lower cost of test by using Advanced TRE technology (ATRE)
Excellent contact stability and electrical performance... |
 FormFactor - TouchMatrix - For 200 mm and 300 mm NAND and NOR Flash wafer testing
One-touchdown probing
Field-adjustable planarity
Efficient, high-integrity electrical test
|
 FormFactor - TrueScale - For advanced wire bond logic and SoC devices
Support for single-row pad layout down to 50 um pitch
Excellent positional accuracy over more than 1 million touchdowns
Minimization of false test failures
Wire... |
