With its compact and rugged design, CMA is a perfect fit for data acquisitions in challenging environments and tight spaces.

CMA boasts the smallest size per channel, providing versatile acquisition modules to customize instrumentation for specific missile or New Space use cases. These acquisition modules enable software configuration in the field for each channel type.

Offering on-board processing, recording, hardware customization, GPS localization, and a built-in transmitter, CMA allows for an all-in-one-box solution.

CMA delivers advanced signal and acquisition conditioning, bus monitoring, recording, and transmission, all while reducing integration time, cost, and risk.

OptoVue

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

Horizontal Die-Level Edge Coupling

• Highest accuracy in test results
• Lowest coupling loss
• Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
• Reduced risk of damaging fibers with collision avoidance technology
• Ease of use for less experienced users
• Enables close simulation of real-world conditions with device performance closest to the final application

See "Specifications & Details" tab for more key features

• Small 
  • Complete, closed-loop system with embedded controls in less than 28 x 13.2 x 7.5 mm 
• Precise 
  • 0.5 µm resolution 
  • 6 mm of travel 
• Simple system integration 
  • High-level motion commands over standard serial interface (I2C or SPI) 
• Flexible system, fast to market 
  • Rapidly configurable for push or pull motion 
• Low voltage / low power use 
  • 3.3 V input, <500 mW power use 
  • Holds position when power is off

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

Quantity in Stock: 1

VNA Master (500 kHz to 4 GHz)

• 2-port, 1-path Vector Network Analyzer (VNA)
• Intuitive Graphical User Interface (GUI) with convenient Touch Screen
• Outstanding calibration stability
• User-defined overlays for viewing multiple S-Parameters
• Exceptional RF immunity
• IF Bandwidth selections of 10 Hz to 100 kHz
• 100 dB Transmission Dynamic Range
• 850 µs/data point sweep speed
• Internal Bias Tee option
• Vector Voltmeter option, ideal for cable phase matching
• Standard three-year warranty (battery one-year warranty)

• Universal input switching supply 
• 24v regulated current DC – runs on 110-220v AC 
• Power indicator light 
• Tinned leads; marked negative/positive with wire nuts for easy connection

See "Specifications & Details" tab for more information