FormFactor - Cascade Unity Probe - Multicontact probe for RFIC engineering test
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
The multi-contact Unity Probe provides highly flexible configurability, unprecedented durability and ease-of use for RFIC engineering test. Unlike “bent-to-order” needle-probe solutions, Unity probes are quickly “built-to-order” with a precision tip cluster featuring multiple independently compliant fingers to isolate chip components from probing stresses — maximizing probe life and durability. Each contact can be configured to one or several contact types and frequencies, and the Unity Probe delivers on the legendary quality you’ve come to expect from our comprehensive suite of probing solutions.
Use our online tool to capture your design requirements and receive a quote.
Use our online tool to capture your design requirements and receive a quote.
More Product Information
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
Customized Solutions for a Variety of Challenging Applications
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Accommodates a combination of up to four Cascade Microtech probes
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Configurable for mixed-signal RF/mmW testing
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Quick and easy repairs to be performed in the field, by simply replacing individual probes
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Adaptable to new device layouts by exchanging individual probes
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Low insertion loss
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Low contact resistance
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Lithographically defined probe tip
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Nickel contacts
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
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DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
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Full thermal range of -60°C to +300°C
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Reliable and repeatable contact
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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High thermal stability components
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On-axis probe-to-pad alignment
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Flexibility from hot only to full thermal range of -60°C to +300°C
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Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
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3 performance level configurations (fully-shielded / shielded / open)
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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User-centered design minimizes training costs and enhances efficiency
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000