• Robust and compact design, easy to handle
• Fast, reliable and highly accurate measuring process
• Integrated hardware and software, touch monitor for intuitive operationReliable, high-precision clamping of the test specimen (including conical tools / conical wire guides)
• The highly precise alignment of camera and test object chuck both enable a highly accurate measurement
• No extraneous light influences thanks to measuring behind closed sliding door

• Very robust device for quick and efficient cutting of flat cables
• Exact adjustment of the sample thickness (depending on material)
• Thin, evenly and parallel cut samples with a smooth surface (especially the very small and many cores require a very thin cut to avoid shadows)
• Precise and repeatable measuring results due to reproducible samples

XenaManager is used to configure and generate streams of Ethernet traffic between Xena test equipment and Devices Under Test (DUTs) at all speeds up to 800Gbps, and analyze the results. It can also be used to add various forms of impairment up to 100Gbps when using the Chimera network emulator.

The user-friendly interface makes XenaManager an effective tool for performing a wide range of core test scenarios for semiconductor & Network Equipment Manufacturers (NEMs), network service providers, and hyperscalers.

• Device and operation according to the standard IEC 60811-504
• The complete set consists of various winding spindles and cable guides for various diameters: Winding spindles: 10, 12, 14.5, 18, 22, 27, 33.5, 41, 50 mm | 0.4, 0.5, 0.57, 0.7, 0.86, 1.06, 1.32, 1.61, 1.96 Inch outer diameter; Cable guides: 3.2, 4, 5, 6.2, 7.7, 9.6, 12, 15 mm | 0.12, 0.15, 0.19, 0.24, 0.30, 0.38, 0.5, 0.59 Inch inner diameter
• The winding spindles and cable guides interlock easily and are easily fastened
• Maneuver Ratio: 5/1: 5x Crank rotation = 1x spindle rotation
• Spindle/Guide diameter ratio: 0.8x sample diameter
• Device suitable for positioning in a cold chamber - Product No.: 402.0020.04

• Device is according to the standard IEC 60811 -501, -507 (Heat elongation test, tensile test)
• Handy, electric device for material tests in laboratories
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)
• Especially for hard materials

• Enables up to 24 braiding spools to be unwound at the same time
• Appropriate spools:
  1. Diameter of mandrel 23 mm (standard version)
  2. Spool outer diameter up to 100 mm
  3. Other spools with different inner and outer diameters possible
• Suitable for different winding materials, e.g. metal wire, plastic, natural, glass and carbon fibres

• Measuring device for large extrusion tools up to 35 mm (1.37“) hole diameter 
• Automated measurement process 
• Focus indicator allows you to easily adjust the focus 
• Homogeneous transmitted light illumination - made by iiM GmbH - for the ideal presentation of the area to measured 
• The influence of the user is reduced to a minimum 
• Robust, ergonomic design 
• Ideal addition to the 2-camera system VCPEx+

• Tackle demanding imaging applications using an eighth-generation Intel Core processor
• Capture directly from GigE Vision® and USB3 Vision® cameras
• Broaden support for Camera Link® , CoaXPress® , DisplayPort, HDMI, and SDI video interfaces using Zebra frame grabbers
• Customize I/O capabilities through four PCIe slots accepting full-height, half-length cards
• Install in space-limited industrial environments given its small footprint and rugged design
• Streamline application development using the Aurora Design Assistant flowchart-based IDE or the Aurora Imaging Library SDK
• Tackle machine vision applications with utmost confidence using field-proven tools for analyzing, locating, classifying, measuring, reading, and verifying
• Leverage machine learning including deep learning to categorize image content
• Ready for deep learning training with suitably equipped and configured model

High-speed, high-capacity, and scalable rugged NVMe storage solutions delivering enhanced performance alongside evolving applications and programs.

*Available in 1U-3U height with high core count CPUs, high-end GPUs and accelerator cards, and PCIe 4.0/5.0 interfaces. GPGPU-accelerated RAID also available.