• Device is according to the standard IEC 60811 -501, -507 (heat elongation test, tensile test)
• The samples are taken from the inner side of the sheath and isolator
• All grooves and/or conductive layers are removed
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)

• Robust and compact design, easy to handle
• Fast, reliable and highly accurate measuring process
• Integrated hardware and software, touch monitor for intuitive operationReliable, high-precision clamping of the test specimen (including conical tools / conical wire guides)
• The highly precise alignment of camera and test object chuck both enable a highly accurate measurement
• No extraneous light influences thanks to measuring behind closed sliding door

• Calibration scale 0.5 - 12 mm (0.02 to 0.5“) polygon
  • 9 different circles from 0.5 to 12.0 mm outer diameter (0.02 to 0.5“)
  • Distance measurements are possible with the polygonal inner shape→ Available with DAkkS- or factory calibration certificate
• Calibration scale 20 / 60 mm (0.8 / 2.4“) polygon
  • 2 different circles (20 / 60 mm (0.8 / 2.4“) outer diameter)
  • Distance measurements are possible with the polygonal inner shape
  • Available with DAkkS- or factory calibration certificate
• Calibration rings 65 / 95 mm (2.5 / 3.7“)
  • 2 different circles (65 / 95 mm (2.5 / 3.7“) outer diameter)
  • Available with DAkkS- or factory calibration certificate
• Calibration case - practical storage of calibration scales

• Preparation of cable samples for further processing
• Applicable for cable types with solid core cross-sections
• E.g. Sample preparation for cutting with ORC family

Configurable, secure, COTS and MOTS rack servers and workstations supporting third-party motherboards to maximize performance, interoperability, and scalability.

*Motherboards are TAA-compliant. mini-ITX, microATX, ATX, and eATX form factors with single/dual Intel Xeon® or Core® CPUs.

**Military- and industrial-grade solutions available.

• Solve applications rather than develop underlying tools by leveraging a toolkit with a more than 25-year history of reliable performance
• Tackle applications with utmost confidence using field-proven tools for analyzing, classifying, locating, measuring, reading and verifying
• Base analysis on monochrome and color 2D images as well as 3D profiles, depth maps and point clouds
• Harness the full power of today's hardware through optimizations exploiting SIMD, multi-core CPU and multi-CPU technologies
• Support platforms ranging from smart cameras to HPCs via a single consistent and intuitive API
• Obtain live data in different ways with support for analog, Camera Link, CoaXPress, DisplayPort, GenTL, GigE Vision, HDMI, SDI, Linux and USB3 Vision Interfaces
• Maintain flexibility and choice by way of support for 64-bit Windows and Linux along with Intel and Arm processor architectures
• Leverage available programming know-how with support for C, C++, C+ and CPython languages
• Experiment, prototype and generate program code using Aurora Imaging Library CoPilot interactive environment

• Quick and efficient cut
• Thin, evenly and parallel cut samples with a smooth surface
• Very robust device made of aluminum and stainless steel - no corrosion
• By using special chuck jaws it is even possible to cut larger samples with an outer diameter up to 200 mm (7.87“)
• Light to illuminate the cutting process
• Precise and repeatable measuring results possible with the cut samples

SCANFLEX II CUBE is the new generation modular JTAG/Boundary Scan controller. Based on the latest multi-core processors and FPGAs, SCANFLEX II CUBE opens new ways for the Embedded JTAG Solutions. The multifunctional architecture of the SCANFLEX II CUBE allows users to combine numerous technologies flexibly and with high performance on a single platform.

• 8 independent and parallel Test Access Ports (TAP) for up to 100 MHz
• Synchronized operation of embedded test, debugging and programming
• Programmable multifunctional 64 channel I/O signal unit
• Programmable TAP protocols for numerous processor debug interfaces
• Support of up to 31 parallel controlled SCANFLEX I/O modules
• Controllable via USB 3.0 and GBit LAN

• Sample preparation according to IEC 60811-501, -507
• Available with either 100mm (3.93“), 75 mm (2.95“) or 50 mm (2.97“) dumb-bell tool
• For inspecting cable sheaths in laboratories
• As a preparation for further tests
• Applicable for all cable types
• Cutting surface also available individually