• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• Maximized Field-of-View with Ultra-Sharp Image Quality
• Slim Design
• Patent-Pending Crash Protection
• Intelligent Lens Mount
• Application Flexibility
• Seamless Integration with Velox Probe Station Control Software
• Autonomous Measurement Assistants
• Remote Operation

See "Specifications & Details" tab for more information

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• Mechanical Platen Lift: Enhances safety during complex RF set-ups, increasing operator confidence and minimizing the risk of errors.
• Ease of Use and Advanced Automation: Fully compatible with FormFactor’s Autonomous RF and DC measurement assistants, as well as Velox Dash™ companion app control.
• Reconfigurable Platen Inserts: Quickly switch between TopHat, PCH, and IceShield inserts within minutes to support a wide variety of test configurations.
• Spacious Platen Design: Provides flexibility for both RF and DC setups without space limitations, ensuring easy integration of different configurations.
• Compact Design: Small footprint with field-upgradable components for smooth integration into existing test cells.
• Low-Volume MicroChamber and FemtoGuard Thermal Triaxial Chuck: Included by default

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz