FormFactor - Cascade Eye-Pass Probe - Durable multi-contact wafer probe with controlled impedance power bypass technology
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
The multi-contact Eye-Pass probe provides controlled impedance power connections enabling functional testing of even the most challenging circuits on-wafer. The high-durability composite multi-finger tip provides high compliance and ensures precise alignment. This custom probe allows the user to select the footprint pattern best suited for the application, with up to 12 contacts per probe head. Available contact types are ground, logic, standard and Eye-Pass power supply, power supply sense, and ac signal.
Use our online tool to capture your design requirements and receive a quote.
Use our online tool to capture your design requirements and receive a quote.
More Product Information
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
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Up to 100 GHz Industry leading analog bandwidth
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Acquisition module configurations with up to:
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4 channels at 36 GHz
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2 channels at 65 GHz
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1 channel at 100 GHz
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Up to 240 GS/s sample rate
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Long Memory - Up to 1.5 Gpt/ch
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Modular Design - build a system with up to 20 acquisition modules, for:
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80 channels at 36 GHz
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40 channels at 65 GHz
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20 channels at 100 GHz
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ChannelSync™ Architecture for 130 fs matching between channels
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Multi-Lane eye, Jitter and Noise Analysis with SDAIII-CompleteLinQ
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Optical Modulation Analysis with Optical-LinQ
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PAM4 Eye, Jitter and Noise Measurements with PAM4 Signal Analysis
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Industry’s only true hardware 14.1 Gb/s serial trigger
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Add 12.5 GS/s mixed-signal capability at any time with the HDA125 high-speed digital analyzer
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
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Fast GigE Vision InGaAs SWIR camera
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VGA resolution
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Power over Ethernet
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Compact industrial design, no fan
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Up to 303 fps at full resolution
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GigE Vision interface with Power over Ethernet
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Comprehensive I/O control options
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Automated on-board image correction
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Stabilized sensor cooling, no fan
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Extended operating temperature range
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
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Low noise GigE Vision InGaAs SWIR camera
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VGA resolution
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Power over Ethernet (PoE+)
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large pixel with high dynamic
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Strong sensor cooling, no condensation
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Very strong sensor cooling for low-noise imaging with long exposure times
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GigE Vision interface with PoE+
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Comprehensive I/O control options
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Automated on-board image correction
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Extended operating temperature range
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000