FormFactor - Cascade |Z| Probe® PCB - Robust RF test on PCB and ceramic
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
Flexibility is the key for efficient PCB and ceramic testing. The |Z| Probe® PCB is simple to align and handle and can be easily positioned. It optimally replaces costly test fixtures which are often inflexible. A robust design makes the |Z| Probe PCB easy to handle and offers a long working life typically more than one million (1,000,000) contacts.
The planar tip of the |Z| Probe PCB has precisely calculated, parallel, separate contact springs which move independently of one another, allowing a precise, quick and simple contact with the DUT, even if there are significant contact height differences. This unique feature as well as the overall very robust design of the |Z| Probe PCB ensures a long life and simple handling.
Used in conjunction with a manual probe system including probe positioners and calibration substrates, the |Z| Probe PCB becomes the ultimate tool for all RF circuit probing needs.
More Product Information
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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die
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Revolutionary technology advancement for wafer and die-level photonics probing
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Real-time in-situ calibrations
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Highest accuracy in test results
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Lowest coupling loss
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Dark, shielded and frost-free
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-40°C to +125°C
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Provides an effectively noise free environment around the device under test (DUT)
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World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
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Up to 4x faster flicker noise thermal testing on 30 μm pads
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Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
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Provides fully managed and filtered AC power to the entire system – prober and instruments
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Filters harmful noise generated by external thermal control systems
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Reduced “antenna effect” injection of unwanted RF noise into the measurement path
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Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Enables full access to the chuck and the auxiliary sites
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Intuitive, and precise movement of chuck in X, Y, and Z-direction
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User-centered design minimizes training costs and enhances efficiency
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Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000