FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
FormFactor’s Ultra-High-Power Probe (UHP), a high-voltage parametric probe, handles both high voltage (up to 10,000 V) and high current (up to 600 A) at a wide temperature range (-60ºC to 300ºC).
The high pulse current achieves full I-V characterization with one setup and one touchdown. Together with a TESLA on-wafer power device characterization system, the UHP fully utilizes the high-voltage/current capability of Keysight B1505A and N1265A Ultra High Current Expanders.
More Product Information
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Simple and repeatable installation
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Rugged (IP67) multipoint monitoring with up to 96 sensors on a single HYPERION instrument
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Ultra high resolution
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Multiparameter various physical parameters measurements coupled onto the same instrumentation platform
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Internally temperature-compensated
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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Infinity Probe: best for Al (Si)
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ACP Probe: best for AU (III-Vs)
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|Z| Probe: robust solution (long lifetime)
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RF chuck ±3 μm surface planarity
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Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
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Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
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Automated calibration monitoring
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Up to 25 GHz bandwidth (probe + oscilloscope)
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System rise time as fast as 13 ps (20-80%)
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Highest bandwidth Solder-In solution (25 GHz)
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Ultra-compact browser tip (22 GHz)
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Superior probe impedance minimizes AC loading on device under test (DUT)
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Carbon-composite browser tips optimizes signal fidelity and loading
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Probe noise as low as 14 nV/√Hz (1.6 mVrms)
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Low probe attenuation
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Large operating voltage range
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±4 V common mode range
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±2.5 V offset range
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2.0 Vpk-pk dynamic range
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Long length Solder-In tip with field replaceable resistors
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Cryogen-free: cooling with two-stage pulse tube refrigerator (PTR)
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Low vibration
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Mechanical heat switch
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Internal charcoal sorption pump
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Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
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Reduced unwanted couplings and transmission modes
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Able to shrink pad geometries to 25 x 35 µm (best case)
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Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
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WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
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Quick and easy probe tip navigation
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Z drive can work in the same range as the chuck
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Enables higher separation gap while the DUT stays in focus
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Automatically configure and optimize performance
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24/7 operating
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Increased MTBF
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Protects the measurement setup
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Prevents involuntary mechanical contact between lens and probes
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High efficiency: up to 81.6%,
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low no load power consumption <95mW,
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meets DoE efficiency level VI,
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CoC version 5 Tier 2,
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ultra-low leakage current ≤10μA,
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IEC 60601-1-2, 4th edition ready,
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wide operating temperature range 0 - 45°C,
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isolation 2x MOPP,
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double housing safety: snapped & welded,
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IP42 approved interchangeable plug system as additional accessories,
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IEC 60601-1-11 ready with IPX2 adapter
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000