Teledyne LeCroy presence at EMC+SIPI 2017

Monday, August 7, 2017 - 08:00
201 Waterfront St
Oxon Hill  Maryland  20745
United States

EMC+SIPI 2017

Washington, DC
Conference: August 7-11, 2017
Expo: August 8-10, 2017

Talk with us in Booth 732 

Teledyne LeCroy will be in exhibiting in Booth 732 as well as contributing to the technical conference.

Booth demonstrations include:

  • EMC/ ESD Measurements using an Oscilloscope
  • Measure first peak current, and t1, t2 voltage levels after pulse
  • Calculate time to halflife automatically
  • Use EMC 0-volts to maximum for the most accurate ESD pulse measurements
  • Calculate time to halflife automatically
  • Power integrity measurements using an Oscilloscope.
  • Techniques for improving signal integrity measurements

Technical Contributions:

  • Sr. Field Applications Engineer Mike Hertz will present: "Detection Methods for Secondary ESD Discharge during IEC 61000-4-2 Testing" in Room Maryland D on Tue, Aug 8 from 2:00 - 2:45PM
  • Dr. Eric Bogatin will participate in the "Ask the Experts - SIPI Panel" in the Exhibit Hall Theatre on Wed, Aug 9 from 10:30AM – 12:00PM
  • Sr. Field Applications Engineer Mike Hertz will present:"ESD Measurement Techniques With Oscilloscopes" in the Rear of the Exhibit Hall on Thu, Aug 10 9:00 - 11:00AM
  • Dr. Eric Bogatin will present: "Development of a PCB Kit for S-Parameter De-Embedding Algorithms Verification" in room Maryland A on Thu, Aug 10 from 8:30 – 9:00AM
  • Dr. Eric Bogatin will present: "Metrics for the Quality to Validate the De-Embedded DUT Result" in room Maryland D on Fri, Aug 11 from 2:25 – 3:00PM

Details & Registration:

http://www.emc2017.emcss.org